Part Number | DILB40P-223TLF |
---|---|
Manufacturer | Storage & Server IO (Amphenol Communications Solutions) |
Other Part Numbers | 609-4716-ND 2266-DILB40P-223TLF 609-4716 |
Description | CONN IC DIP SOCKET 40POS TIN |
Detailed Description | 40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole |
Manufacturer Standard Lead Time | 11 weeks |
Datasheet | Datasheet |
Category | ||
---|---|---|
Manufacturer | Storage & Server IO (Amphenol Communications Solutions) | |
Series | ||
Packaging | Tube | |
Part Status | Active | |
Features | Open Frame | |
Mounting Type | Through Hole | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Operating Temperature | -55°C ~ 105°C | |
Number of Positions or Pins (Grid) | 40 (2 x 20) | |
Termination | Solder | |
Material Flammability Rating | UL94 V-0 | |
Housing Material | Polyamide (PA), Nylon | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Tin | |
Contact Finish Thickness - Mating | 100.0µin (2.54µm) | |
Contact Material - Mating | Copper Alloy | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin | |
Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
Contact Material - Post | Copper Alloy | |
Termination Post Length | 0.124" (3.15mm) | |
Contact Resistance | 30mOhm | |
Current Rating (Amps) | 1 A |
RESOURCE TYPE | LINK | |
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Datasheets | DILB40P-223TLF |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 8536.69.4040 | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
REACH Status | REACH Unaffected | |
RoHS Status | RoHS Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
---|---|---|
1 | $1.36 | $1.36 |
12 | $1.15 | $13.80 |
36 | $1.11 | $39.96 |
60 | $1.08 | $64.80 |
108 | $1.03 | $111.24 |
252 | $0.94 | $236.88 |
504 | $0.85 | $428.40 |
1,008 | $0.75 | $756.00 |
2,508 | $0.68 | $1,705.44 |