Part Number |
SMDSWLF.006 1G
|
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Manufacturer | Chip Quik, Inc. |
Other Part Numbers |
315-SMDSWLF.0061G-ND
315-SMDSWLF.0061G
|
Description | SOLDER WIRE SN96.5/AG3/CU0.5 |
Detailed Description | Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g) |
Manufacturer Standard Lead Time | 4 weeks |
Datasheet | Datasheet |
Category | ||
---|---|---|
Manufacturer | Chip Quik, Inc. | |
Series | ||
Packaging |
Bulk
|
|
Part Status | Active | |
Diameter | 0.006" (0.15mm) | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Type | Wire Solder | |
Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
Form | Spool, 0.035 oz (1g) | |
Process | Lead Free | |
Flux Type | No-Clean, Water Soluble |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | SMDSWLF.006 1G |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 8311.30.6000 | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
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