Menu

WS991LT35T4

Part Number
WS991LT35T4
Manufacturer Chip Quik, Inc.
Other Part Numbers
315-WS991LT35T4-ND
315-WS991LT35T4
Description THERMALLY STABLE SOLDER PASTE WS
Detailed Description Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (34.869g)
Manufacturer Standard Lead Time 4 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status Active
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type Solder Paste
Melting Point 280°F (138°C)
Form Syringe, 1.23 oz (34.869g)
Mesh Type 4
Flux Type Water Soluble
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start Date of Manufacture
Shelf Life 12 Months

Documents & Media

RESOURCE TYPE LINK
Datasheets WS991LT35T4
HTML Datasheet WS991LT35T4 Datasheet

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
California Prop 65 California Prop 65 Information
ECCN EAR99
HTSUS 3810.10.0000
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 14

Can ship immediately.
PACKAGING QUANTITY UNIT PRICE EXT PRICE
{{ p.name }} {{ numberFormat(p.buyQty) }} {{ priceFormat(p.unitPrice) }} {{ priceFormat(p.totalPrice) }}
Total Amount: {{ priceFormat(quotes.total) }} (including {{ priceFormat(quotes.fee) }} fee)

{{ package.name }}

QUANTITY UNIT PRICE EXT PRICE
{{ numberFormat(price.break_quantity) }} {{ priceFormat(price.unit_price) }} {{ priceFormat(price.break_quantity * price.unit_price) }}
Detailed pricing is currently unavailable.
Detailed packaging information is temporarily unavailable.