Part Number |
WS991LT35T4
|
---|---|
Manufacturer | Chip Quik, Inc. |
Other Part Numbers |
315-WS991LT35T4-ND
315-WS991LT35T4
|
Description | THERMALLY STABLE SOLDER PASTE WS |
Detailed Description | Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (34.869g) |
Manufacturer Standard Lead Time | 4 weeks |
Datasheet | Datasheet |
Category | ||
---|---|---|
Manufacturer | Chip Quik, Inc. | |
Series |
CHIPQUIK®
|
|
Packaging |
Bulk
|
|
Part Status | Active | |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
Type | Solder Paste | |
Melting Point | 280°F (138°C) | |
Form | Syringe, 1.23 oz (34.869g) | |
Mesh Type | 4 | |
Flux Type | Water Soluble | |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) | |
Shelf Life Start | Date of Manufacture | |
Shelf Life | 12 Months |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | WS991LT35T4 | |
HTML Datasheet | WS991LT35T4 Datasheet |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
California Prop 65 | California Prop 65 Information | |
ECCN | EAR99 | |
HTSUS | 3810.10.0000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
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